Light emitting device

ABSTRACT

A light emitting device includes: a base member having a first surface including a first region and a second region; a first frame provided on the base member and surrounding the first region; a light emitting element provided on the base member in the first region; a light-transmissive first member provided inward of the first frame, and covering the light emitting element; an electronic component provided on the base member in the second region and electrically connected with the light emitting element; and a plurality of pin holes arrayed in a first direction and electrically connected with the electronic component, the first direction being orthogonal to a thickness direction of the base member. The electronic component is provided on a side opposite the plurality of pin holes with respect to the light emitting element in a second direction that is orthogonal to the thickness direction and the first direction.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/517,109, filed on Jul. 19, 2019, which claims priority to JapanesePatent Application No. 2018-136824, filed on Jul. 20, 2018, thedisclosures of which are hereby incorporated by reference in theirentireties.

BACKGROUND

The present disclosure relates to a light emitting device.

Light emitting devices are known in which a light emitting element andan electronic component are mounted on a base member. By mounting lightemitting elements and electronic components on one base member, a lightemitting device can be reduced in size as compared to a case where suchcomponents are separately provided, and connected. It is desired toimprove the light extraction efficiency of the light emitting device.(See, for example, Japanese Patent Publication No. 2017-139404.)

SUMMARY

One object of the present disclosure is to provide a light emittingdevice with improved light extraction efficiency.

A light emitting device according to one aspect of the presentdisclosure includes: a base member having a first surface including afirst region and a second region; a first frame provided on the basemember and surrounding the first region; a light emitting elementprovided on the base member while being in the first region; alight-transmissive first member provided inward of the first frame, andcovering the light emitting element; a second frame provided on the basemember and surrounding the second region; an electronic componentprovided on the base member while being in the second region; and anon-light-transmissive second member provided inward of the second frameand covering the electronic component. A part of the first frame and apart of the second frame are integrated with each other. An uppersurface of the first member is positioned higher than an upper surfaceof the first frame, an upper surface of the second frame, and an uppersurface of the second member.

According to certain embodiments of the present disclosure, the lightextraction efficiency of a light emitting device can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a light emitting deviceaccording to an embodiment.

FIG. 2 is a top view illustrating the light emitting device according tothe embodiment.

FIG. 3 is a top view illustrating the light emitting device according tothe embodiment.

FIG. 4 is a top view illustrating a base member of the light emittingdevice according to the embodiment.

FIG. 5 is a sectional view taken along line A-A′ in FIG. 2.

FIG. 6 is a sectional view taken along line B-B′ in FIG. 2.

FIG. 7 is a circuit diagram illustrating a circuit configuration of thelight emitting device according to the embodiment.

FIG. 8 is a top view illustrating a light emitting device according to amodification of the embodiment.

FIG. 9 is a top view illustrating the light emitting device according tothe modification of the embodiment.

FIG. 10 is a sectional view taken along line C-C′ in FIG. 8.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be describedwith reference to the drawings. In the drawings, the same referencenumerals are assigned to the same constituent elements, and repeateddescriptions thereof are omitted as appropriate.

FIG. 1 is a perspective view illustrating a light emitting deviceaccording to the embodiment.

FIGS. 2 and 3 are top views illustrating the light emitting deviceaccording to the embodiment.

FIG. 4 is a top view illustrating a base member of the light emittingdevice according to the embodiment.

FIG. 3 is a diagram in which some constituent elements are omitted orseen through to show the internal structure of the light emittingdevice.

As shown in FIGS. 1 to 3, for example, a light emitting device 1according to one embodiment includes a base member 10, at least a lightemitting element 20, at least an electronic component 30, a first frame41, a second frame 42, a first member 51 and a second member 52.

The base member 10 is an insulating member having a flat plate shape.The base member 10 has a first surface 10 a on which a wiring pattern 14is formed. The first surface 10 a includes a first region 11 and asecond region 12 as shown in FIG. 4. The first region 11 is a region inwhich the light emitting elements 20 are mounted, and the second region12 is a region in which the electronic components 30 are mounted. Asshown in FIGS. 2 and 3, the light emitting elements 20 and theelectronic components 30 are mounted on the first region 11 and thesecond region 12, respectively, and electrically connected to the wiringpattern 14 of the base member 10.

The base member 10 is formed of, for example, a ceramic material such asalumina or aluminum nitride. The base member 10 may be formed using anelectrically insulating resin material such as phenol resin, epoxyresin, polyimide resin, BT resin or polyphthalamide. The wiring pattern14 is formed using an electrically conductive material, such as gold,silver, copper or aluminum. The base member 10 may be configured with ametal member and an insulating member that is provided on a surface ofthe metal member in a layered structure, and in this case, the wiringpattern 14 is formed on the insulating member.

The light emitting element 20 is, for example, a light emitting diode.The specific configuration of the light emitting element 20 may beappropriately determined as long as light having a predeterminedwavelength can be emitted. For example, an LED chip housed in a package,or an LED chip alone (i.e., bare chip) may be employed as the lightemitting element 20. It is desirable that the light emitting element 20is a bare chip being flip-chip-mounted on the base member 10.

The wavelength of light that is emitted from the light emitting element20 is appropriately set according to a use of the light emitting device1. For example, the light emitting element 20 may contain anitride-based semiconductor (In_(X)Al_(Y)Ga_(1-X-Y)N, 0≤X, 0≤Y, X+Y≤1),and emit blue light. A plurality of light emitting elements 20 may beprovided on the first region 11. In the light emitting device 1, aplurality of light emitting elements 20 a to 20 c is connected in seriesas shown in FIG. 3.

The electronic component 30 is, for example, a thermistor, a transistor,a rectifying diode or the like. For example, a semiconductor chip housedin a package, or a semiconductor chip alone (i.e., bare chip) may beemployed as the electronic component 30. A plurality of electroniccomponents 30 may be provided on the second region 12. As shown in FIG.3, for example, a plurality of electronic components 30 a to 30 g areelectrically connected to the wiring pattern 14 of the base member 10directly or through a bonding wire W. For example, a plurality ofelectronic components 30 a to 30 g may be bare chips that respectivelyare a thermistor, a transistor and a rectifying diode. As shown in FIG.3, a portion of the electronic component 30 may be covered with thesecond frame 42.

The first frame 41 and the second frame 42 are provided on the basemember 10. The first frame 41 surrounds the first region 11, and thesecond frame 42 surrounds the second region 12. That is, the lightemitting elements 20 provided on the first region 11 are surrounded bythe first frame 41. The electronic components 30 provided on the secondregion 12 are surrounded by the second frame 42. The first frame 41 andthe second frame 42 are non-light-transmissive. In the first lightemitting device 1, a part of the frame 41 and a part of the second frame42 are integrated with each other as shown in FIG. 2. That is, the firstframe 41 and the second frame 42 share a part of each other.

The first member 51 is provided inside the first frame 41, and covers orencapsulates a plurality of light emitting elements 20. An upper surfaceof the first member 51 is positioned higher than an upper surface of thefirst frame and an upper surface of the second frame, and constitutes alight emitting surface of the light emitting device 1. The first member51 has light-transmissivity so as to transmit light emitted from thelight emitting element 20. The second member 52 is provided inward ofthe second frame 42, and covers or encapsulates a plurality ofelectronic components 30 and the bonding wires. The second member 52 isnon-light-transmissive.

The first frame 41, the second frame 42, the first member 51 and thesecond member 52 contain, for example, a resin. As the resin, phenylsilicone resin, dimethyl silicone resin or the like can be used. Thespecific compositions of the first frame 41, the second frame 42, thefirst member 51 and the second member 52 may be the same or different.

In the first frame 41, the second frame 42, and the second member 52, apigment may be added to impart non-light-transmissivity. For example, inthe first frame 41, the second frame 42, and the second member 52, awhite pigment or the like may be added to the resin for enhancing thereflectivity. As the white pigment, titanium oxide or alumina may beused.

The first member 51 may contain a fluorescent material. The fluorescentmaterial is excited by light emitted by the light emitting element 20,and emits light having a wavelength different from the wavelength oflight emitted by the light emitting element 20. As the fluorescentmaterial, a YAG-based fluorescent material, a β-SiAlON-based fluorescentmaterial, a KSF-based fluorescent material or the like can be used. Asone example, the light emitting element 20 emits blue light, and thefirst member 51 contains a YAG fluorescent material that emits yellowlight. In this case, white light is emitted from the upper surface(i.e., light emitting surface) of the first member 51. As anotherexample, the light emitting element 20 emits blue light, and the firstmember 51 contains a nitride fluorescent material that emits red light,and a YAG fluorescent material that emits yellow light. In this case,light having a color such as red or amber is emitted from the lightemitting surface.

FIG. 5 is a sectional view taken along line A-A′ in FIG. 2.

FIG. 6 is a sectional view taken along line B-B′ in FIG. 2.

As shown in FIGS. 5 and 6, an upper surface 51 a of the first member 51is positioned higher than an upper surface 41 a of the first frame 41,an upper surface 42 a of the second frame 42, and an upper surface 52 aof the second member 52. The upper surface 52 a of the second member 52may be flush with the upper surface 41 a of the first frame 41 and theupper surface 42 a of the second frame 42, or may be positioned lowerthan these upper surfaces as shown in FIGS. 5 and 6.

The light emitting device 1 is produced by, for example, the followingmethod.

The light emitting elements 20 and the electronic components 30 aremounted on the base member 10 provided with the wiring pattern 14.Subsequently, an uncured resin material is disposed on the base member10 in such a manner as to surround the light emitting elements 20 andthe electronic components 30, and cured to form the first frame 41 andthe second frame 42. Specifically, the first frame 41 and the secondframe 42 are formed by, for example, setting a needle of a resindischarging apparatus above the base member 10, and moving the needlewhile discharging the uncured resin material from the tip of the needleonto the base member 10. The uncured resin material discharged from theneedle is wetted and spread on the base member 10 to form the firstframe 41 and the second frame 42, which have a substantiallysemicircular shape in a sectional view.

Subsequently, a light-transmissive resin material to be the first member51 is poured inside the first frame 41, and a non-light-transmissiveresin material to be the second member 52 is poured inside the secondframe 42. These resins are cured to form the first member 51 and thesecond member 52, so that the light emitting element 20 and theelectronic component 30 are encapsulated. The first member 51 may beformed before or after forming the second member 52.

Effects of the embodiments will next be described.

In the light emitting device 1 according to one embodiment, the uppersurface 51 a of the first member 51 that covers the light emittingelement 20 is positioned higher than the upper surface 41 a of the firstframe 41, the upper surface 42 a of the second frame 42 and the uppersurface 52 a of the second member 52 as shown in FIGS. 5 and 6. Lightemitted from the light emitting element 20 is extracted from the uppersurface 51 a of the first member 51. The upper surface 51 a ispositioned higher than the upper surfaces 41 a, 42 a and 52 a of othermembers, thus the extracted light is less likely to be reflected orabsorbed by other members. As a result, light emitted from the lightemitting element 20 can be efficiently extracted outside. That is,according to this embodiment, the light extraction efficiency of thelight emitting device 1 can be improved.

In the light emitting device 1, it is desirable that the area of thesecond region 12 on which the electronic component 30 be larger than thearea of the first region 11 on which the light emitting element 20 ismounted. This is because the second region 12 having a larger area thanthe area of the first region 11 can allow a larger number of electroniccomponents 30 to be mounted on the second region 12.

With the second region 12 having a large area, a plurality of electroniccomponents 30 can be mounted on a plane surface without overlapping theelectronic components 30 on one another even if the light emittingdevice 1 includes a large number of electronic components 30.Accordingly, the upper surface 52 a of the second member 52 covering theelectronic component 30 can be at a lower position. Locating the uppersurface 52 a at the lower position can make the upper surface 51 a ofthe first member 51 to be at a lower position necessary to satisfy theabove-described relationship. As a result, the height of the lightemitting device 1 can be reduced, so that the light emitting device 1can be reduced in size.

Regarding the first frame 41 and the second frame 42, it is desirablethat a part of the first frame 41 and a part of the second frame 42 beintegrated with each other as shown in FIG. 2. With this configuration,the area occupied by the first frame 41 and the second frame 42 can bereduced on the base member 10, so that the light emitting device 1 canbe reduced in size.

It is desirable that the electronic components 30 and the base member 10(substantially the wiring pattern 14) be electrically connected to eachother using a bonding wires W. By connecting the electronic components30 and the wiring pattern 14 to each other with the bonding wires W, theflexibility of arrangement of the electronic component 30 can beimproved, so that the electronic component 30 can be efficientlyarranged on the second region 12.

It is desirable that the upper surface 52 a of the second member 52 bepositioned lower than the upper surface 41 a of the first frame 41 andthe upper surface 42 a of the second frame 42. With this configuration,the volume per unit area of the second member 52 inside the second frame42 can be decreased. When the temperature of the light emitting device 1increases or decreases, the temperature of the second member 52 ischanged, and at this time, the volume of the second member 52 is changedaccording to the temperature change. Decrease in the volume of thesecond member 52 can decrease the amount change of the volume of thesecond member 52 due to a temperature change, so that stress applied tothe electronic component 30 can be reduced. As a result, damage to theelectronic component 30 and occurrence of connection failure can beattenuated, to thereby improve the reliability of the light emittingdevice 1.

In particular, when the bonding wire W is used, it is desirable that thesecond member 52 have a small volume. Decrease in the volume change ofthe second member 52 due to a temperature change can reduce thepossibility of breakage occurrence of the bonding wire W, thus thereliability of the light emitting device 1 can further be improved.

Preferably, the light emitting element 20 is flip-chip-mounted on thebase member 10. With flip-chip-mounting, electrodes of the lightemitting elements 20 and conductive wiring on the base member areelectrically connected to each other using a paste-like bonding memberhaving electrical conductivity, such as solder, a thin film-like orbump-like bonding member, or the like.

It is desirable that the electronic component 30 be a bare chip of oneof a thermistor, a transistor and a diode. Using a bare chip can reducethe proportion of the area that the electronic component 30 occupies onthe base member 10, as compared to a case in which a packaged componentis used. In addition, using a bare chip can allow the second member 52to easily embed the electronic components, so that the light emittingdevice 1 can be reduced in size.

In addition, the second frame 42 has a plurality of corner portions C.In other words, the second frame 42 has a polygonal shape constituted bya plurality of straight-line portions and curved line portions in a topview. It is desirable that the interior angle of the corner portion C be90 degrees or more as shown in FIGS. 2 and 3.

As described above, the second member 52 is formed by pouring an uncuredresin material inward of the second frame 42, and curing the resinmaterial. At this time, in the case where the interior angle of thecorner portion C is less than 90 degrees, the uncured resin materialeasily runs onto the second frame 42 at the corner portion C. That is,there is a possibility that the upper surface 52 a of the second member52 is positioned higher than other portions at the corner portion C.When the position of the upper surface 52 a partially rises, the uppersurface 51 a is required to be higher than the rising part of the uppersurface 52 a, resulting in increase of size of the light emitting device1.

When the interior angle of the corner portion C is 90 degrees or more,the resin material is easily drawn off at the corner portion C, so thatrising of the position of the upper surface 52 a at the corner portion Ccan be suppressed. As a result, rising of the position of the uppersurface 51 a is also suppressed, so that the light emitting device 1 canbe reduced in size.

Similarly, it is desirable that the shape of the first frame 41 be apolygonal shape with four or more sides, or a substantially ellipticalshape. Accordingly, the resin material is easily sunk in formation ofthe first member 51, thereby attenuating rise of the upper surface 51 aof the first member 51, so that the light emitting device 1 can bereduced in size.

When at least one of the first frame 41 and the second frame 42 has apolygonal shape, the tips of corner portions of the polygonal shape mayhave a rounded shape due to spreading of the resin material dischargedonto the base member.

As shown in FIGS. 1 to 3, printed resistors 15 a to 15 c, a protectiveglass 16, a protective resin 17, an electronic component 18 a, anelectronic component 18 b and the like are further provided on the basemember 10. As shown in FIG. 3, the printed resistors 15 a to 15 c areprinted on the first surface 10 a of the base member 10, and connectedbetween predetermined portions of the wiring pattern 14. As shown inFIG. 2, the protective glass 16 covers a part of the wiring pattern 14and the printed resistors 15 a to 15 c. The protective resin 17 isprovided on the protective glass 16 in such a manner as to overlap theprinted resistors 15 a to 15 c.

The base member 10 is provided with pin holes 19 a and 19 b. At the timeof mounting the light emitting device 1 in a socket or the like, anexternal plug (i.e., terminal) passes through each of the pin holes 19 aand 19 b to establish electrical connection to the wiring pattern 14.The electronic components 18 a and 18 b are electrically connected tothe wiring pattern 14, and connected between a terminal on the pin hole19 a side and a terminal on the pin hole 19 b side.

At this time, the first frame 41 is disposed at substantially the centerof the base member 10, and the pin holes 19 a and 19 b are positioned inthe vicinity of the outer edge of the base member. The second frame isdisposed along an outer edge opposite to the outer edge positioned closeto the pin holes 19 a and 19 b. Such configuration is preferable becausethe pin holes 19 a and 19 b which are electrical connection portions tothe outside can be disposed separately from the electronic components,and therefore, for example, when a heat sink is disposed directly underthe electronic component, the heat sink is easily separated from theexternal connection terminals.

FIG. 7 is a circuit diagram illustrating a circuit configuration of thelight emitting device according to the embodiment.

The light emitting device 1 has a circuit configuration as shown in, forexample, FIG. 7. In the example shown in FIG. 7, three light emittingelements 20 a to 20 c, two printed resistors 15 a to 15 c, oneprotective element 18 a, one capacitor 18 b, one rectifying diode 30 a,three transistors 30 b to 30 d and three thermistors 30 e to 30 g areprovided.

In the light emitting device according to this embodiment, onerectifying diode 30 a, three transistors 30 b to 30 d and threethermistors 30 e to 30 g are disposed as electronic components in thesecond frame 42.

For example, a positive electrode terminal is inserted into the pin hole19 a, and a negative electrode terminal is inserted into the pin hole 19b. The positive electrode terminal is connected to the rectifying diode30 a. On the negative electrode side of the rectifying diode, the lightemitting elements 20 a to 20 c are connected to the printed resistor 15a in parallel. The negative electrode side of the light emittingelements 20 a to 20 c are connected to collectors of two transistors 30b and 30 c. The transistors 30 b and 30 c are connected in parallel.

The negative electrode side of the printed resistor 15 a is connected tobases of the transistors 30 b and 30 c. The negative electrode side ofthe printed resistor 15 a is also connected to a collector of thetransistor 30 d. Emitters of the transistors 30 b and 30 c are connectedto a base of the transistor 30 d. The printed resistors 15 b and 15 cand the thermistors 30 e to 30 g are connected in parallel between theemitters of the transistors 30 b and 30 c and an emitter of thetransistor 30 d. The emitter of the transistor 30 d is connected to thenegative electrode terminal.

Value of current passing through the light emitting device 1 isdetermined by voltage between the base and the emitter (i.e.,base-emitter voltages V_(BE)) of the transistors 30 b to 30 d, electricresistances of the printed resistors 15 b and 15 c, and electricresistances of the thermistors 30 e to 30 g. As a current passes throughthe light emitting device 1, the temperatures of the transistors 30 band 30 c are elevated, and the voltage V_(BE) decreases. The thermistors30 e to 30 g have inverse characteristics so as to compensate for achange of the voltage V_(BE) due to a temperature change. That is, whenthe temperatures of the thermistors 30 e to 30 g are elevated, theelectric resistances of the thermistors decrease. This can attenuatevariance in a value of current passing through the light emitting device1 even if the temperature of the light emitting device 1 is changed byheat generation. Parallel connection of a plurality of transistors, andparallel connection of a plurality of thermistors can allow a largercurrent to pass through the light emitting device 1.

The electronic component 18 a and the electronic component 18 b arefurther connected in parallel between the negative electrode side of therectifying diode and the negative electrode terminal. The electroniccomponent 18 a is a Zener diode. In case of generation of a temporarilylarge voltage (i.e., surge) in the circuit, a current passes through theZener diode, so that other electronic components can be protected frombreakage. The electronic component 18 b is a capacitor. Provision of thecapacitor can attenuate passage of current noise components through thelight emitting elements 20 a to 20 c.

The light emitting device 1 having the above-mentioned circuitconfiguration is used for, for example, lighting in direction indicatorsof vehicles, DRL (i.e., daytime running lamps) and the like. The circuitconfiguration shown in FIG. 7 is a merely example. The light emittingdevice 1 may have another circuit configuration. The circuitconfiguration of the light emitting device 1 can be appropriatelychanged according to a use application and the like of the lightemitting device 1.

Modification

FIGS. 8 and 9 are top views illustrating a light emitting deviceaccording to a modification of the embodiment.

FIG. 9 is a diagram in which some constituent elements are omitted orseen through to show the internal structure of the light emittingdevice.

The light emitting device 2 shown in FIGS. 8 and 9 further includes athird member 53 covering lateral surfaces of a first member 51. Thefirst member 51 and the third member 53 are provided on a base member 10in a first region 11. The first member 51 is surrounded by the thirdmember 53, and covers a plurality of light emitting elements 20. Thatis, the first member 51 is provided on the light emitting element 20while being inward of a first frame 41, and the third member 53 ispacked in other portions.

The first member 51 is light-transmissive, and the third member 53 isnon-light-transmissive. The first member 51 has a plate shape, and is,for example, a glass plate. The glass plate may contain a fluorescentmaterial, and/or may be colored. Alternatively, a material containing afluorescent material may be formed on a surface of the glass plate byprinting or the like. As other examples, the first member 51 may be asintered body of a fluorescent material, a resin, a ceramic, or otherinorganic substance, which contain a fluorescent material. The thirdmember 53 contains, for example, a resin. The third member 53 maycontain a white pigment in the same manner as the second member 52.Providing the first member 51 and the third member 53 in the firstregion 11 can define a light emitting surface (i.e. an upper surface ofthe first member 51) in a predetermined region, so that a range of lightemission by the light emitting device 2 can be limited.

In the light emitting device 2, the shape of a first frame 41 in a topview is a polygonal shape with six or more sides (an octagonal shape inthis example). The shape of the first frame 41 in a top view may be acircular shape as shown in FIGS. 1 to 3.

FIG. 10 is a sectional view taken along line C-C′ in FIG. 8.

In the light emitting device 2, the upper surface 51 a of the firstmember 51 is positioned higher than an upper surface 41 a of the firstframe 41, an upper surface 42 a of a second frame 42, and an uppersurface 52 a of the second member 52 as shown in FIG. 10. The uppersurface 51 a is positioned higher than the upper surface 53 a of thethird member 53. This can improve light extraction efficiency of thelight emitting device 2 as in the light emitting device 1. In this way,the specific configuration of the light emitting device can beappropriately changed as long as the upper surface 51 a of the firstmember 51 and the upper surfaces of other members satisfy theabove-described positional relationship.

The foregoing embodiment is an example of implementation of the presentdisclosure, and the scope of the present disclosure is not limited tothe embodiment herein. Embodiments achievable with a design change madeto the aforementioned embodiment as appropriate by those skilled in theart are within the scope of the present disclosure as long as theyinclude the spirit of the present disclosure.

What is claimed is:
 1. A light emitting device comprising: a base memberhaving a first surface including a first region and a second region; afirst frame provided on the base member and surrounding the firstregion; a light emitting element provided on the base member in thefirst region; a light-transmissive first member provided inward of thefirst frame, and covering the light emitting element; an electroniccomponent provided on the base member in the second region andelectrically connected with the light emitting element; and a pluralityof pin holes arrayed in a first direction and electrically connectedwith the electronic component, the first direction being orthogonal to athickness direction of the base member; wherein the electronic componentis provided on a side opposite the plurality of pin holes with respectto the light emitting element in a second direction that is orthogonalto the thickness direction and the first direction.
 2. The lightemitting device according to claim 1, wherein an upper surface of thefirst member is positioned higher than an upper surface of the firstframe.
 3. The light emitting device according to claim 1, furthercomprising: a second frame provided on the base member and surroundingthe second region; and a non-light-transmissive second member providedinward of the second frame, and covering the electronic component. 4.The light emitting device according to claim 3, wherein a part of thefirst frame and a part of the second frame are integrated with eachother; and an upper surface of the first member is positioned higherthan an upper surface of the first frame, an upper surface of the secondframe, and an upper surface of the second member.
 5. The light emittingdevice according to claim 3, wherein an upper surface of the secondmember is positioned lower than an upper surface of the first frame andan upper surface of the second frame.
 6. The light emitting deviceaccording to claim 1, wherein the electronic component includes a barechip of at least one of a thermistor, a transistor, or a rectifyingdiode.
 7. The light emitting device according to claim 1, wherein theelectronic component is a bare chip of a thermistor.
 8. The lightemitting device according to claim 1, wherein the first member containsa fluorescent material.